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EVENTS:

Buletin Senggara Fasilit Jalan Buletin June 2014PSKLM International Expressway
Conference & Exhibition 2015.

May 25-27, 2015 at MATRADE Exhibition & Convention Centre, Kuala Lumpur.

Visit us at Booth No.S01 & S02.

Buletin Senggara Fasilit Jalan Buletin June 20149th Malaysian Road Conference 2014
Invention & Innovation Exhibition.

November 10-12, 2014 at Sunway Pyramid Convention Centre (SPCC).


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BondGrip
   
BondGrip
Screed Method
High Skid Resistance Reflective Thermoplastic Road Marking Materials
 
 
 

 
Technical Highlights:
Compliance BSEN 1436 : 2007 + A1 : 2008
Skid Resistance Value
≥ 45 BPN
Normal Thickness ± 2.00 mm
Heating Temperature 180°C - 220°C

Pre-Marking Surface Preparation

The road surface should be dry, swept clear from dirt and free from other contaminants. Avoid vehicle running over the new marking for the prevention of marking line being obliterated and discolored.


Product Application

The maximum safe heating temperature is 220 Degree Centigrade and it should not be exceeded. This is to prevent from deterioration of both pigment and resin binder.